Ubukhulu obuchanekileyo be-ENIG plating buthintela ukubola kwe-black pad, bugcina ukuthembeka kwejoyinti ye-solder, kwaye buxhasa ukumelana okuncinci kokuthintana. I-Nickel kwi-3–6 μm inika umqobo oqhubekayo wokusasazwa kwee-copper pads kwaye igcina iindlela zombane, ngelixa igolide ye-0.05–0.15 μm ikhusela i-nickel kwi-oxidation de kube kwenzeka i-soldering. Ukuphambuka okungaphantsi kwe-3 μm nickel okanye igolide ye-0.05 μm kwandisa kakhulu ukusilela kokuthintana kwii-PCB ezinoxinano oluphezulu, olune-pitch encinci.
Ukulinganiswa koBungqingqwa bePlating kwiMveliso yePCB
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Isishwankathelo seNkqubo yokuPlata ye-ENIG
Ukufakwa kwe-ENIG plating kuqala ngokubeka i-nickel engena-electro kwi-copper pads, kusetyenziswa i-chemical reaction ukwenza umaleko we-nickel-phosphorus osasazwe ngokulinganayo. Ubukhulu be-nickel buchaphazela ngokuthe ngqo amandla oomatshini kunye nokuqhuba kombane—amaxabiso angaphandle koluhlu lwe-2.5–7 μm andisa ukusilela kwendibano kwaye anciphise ubomi bemveliso. Inqanaba legolide yokuntywiliselwa ligquma i-nickel ngegolide ye-0.05–0.23 μm ngokusebenzisa i-ionic displacement, ibonelela ngokugubungela okungenamsebenzi kunye nesakhiwo esichanekileyo sengqolowa. Ulawulo lomlinganiselo we-nickel-phosphorus lumisela umgangatho wokugqiba, ngelixa ubukhulu begolide obuhambelanayo buthintela ukufuduka kwe-nickel kwaye bunciphisa umngcipheko wokugqwala. Umvavanyi we-Lonnmeter LONN-T850 XRF ulinganisa ngokuchanekileyo zombini iileya, okuvumela ulawulo lomgangatho we-PCB plating oluqinileyo kunye nokuthobela imigangatho yobukhulu be-ENIG plating.
Izikhokelo zoButyebi kunye neeThagethi zoMgangatho ze-ENIG
Ubukhulu be-nickel plating ye-ENIG kufuneka buhlale ngaphakathi kwe-2.5–7 μm ukuze kufezekiswe imigangatho ye-IPC-4552B, apho ukuthembeka okuphezulu kufunyenwe ukusuka kwi-3.0–6.0 μm. Olu luhlu lwe-nickel luqinisekisa ukunyibilika okuqinileyo, umqobo ozinzileyo wokusasazeka kobhedu, kunye nokumelana nokugqwala okusebenzayo kwiindlela eziphezulu kunye noyilo lwe-PCB yendabuko. Igolide yokuntywiliselwa kufuneka ilinganise i-0.05–0.23 μm, iphucula ukhuseleko lwe-nickel ngelixa ithintela amalungu e-brittle solder; uluhlu lwegolide oluqhelekileyo noluthembekileyo yi-0.05–0.15 μm yokusetyenziswa kwemveliso enkulu.
Ukuphambuka kule migangatho yobukhulu beplating kwandisa umngcipheko weziphene. Iileya ze-nickel ezingaphantsi kwe-2.5 μm zibangela ukugqwala ngokukhawuleza, i-black pad, kunye namajoyinti e-solder abuthathaka. I-nickel egqithisileyo inokungenisa uxinzelelo lwangaphakathi kodwa ayifane ibe yindawo yokusilela ngaphakathi kwemida echaziweyo. Igolide encinci kune-0.05 μm ivumela i-nickel oxidation, inciphise ubomi beshelufu kunye nokukwazi ukunyibilikisa. Igolide engaphezulu kwe-0.23 μm ikhokelela ekumanziseni kakubi, ekunyibilikeni kwegolide ephezulu, kunye namajoyinti angathembekanga ngenxa yokuqhekeka.
Ulawulo olufanelekileyo lobukhulu be-ENIG luyayimisa i-nickel ezenzekelayo ukuba ifudukele kwigolide, igcina ukumelana okuphezulu koqhagamshelwano kwaye ithintele ukungaphumeleli kokumelana okuncinci. Ulwakhiwo oluchanekileyo lweenkozo kuzo zombini iileya luqinisekisa ukuhanjiswa kombane kunye nokugqitywa komphezulu ofanayo, okubalulekileyo ekumelaneni okuncinci koqhagamshelwano kwiindawo zokudibanisa kunye ne-BGA. Ii-analyzer ze-Lonnmeter XRF ezizenzekelayo ngokupheleleyo zibonelela ngokulinganisa ngokuthe ngqo iileya ze-nickel kunye negolide, zixhasa ezi zikhokelo zomgangatho ezingqongqo kuzo zonke izikali zokuvelisa ze-PCB.
Iingenelo eziphambili ze-ENIG kwiiBhodi zeSekethe eziPrintiweyo
I-ENIG ibonelela ngolungelelwano oluphezulu, olwenza ukuba kube lula ukubeka izinto ezicolekileyo nezixineneyo kwiibhodi zesekethe eziprintiweyo. Igolide eqinileyo iphucula ukunyibilikiswa kwe-solder, ikhuthaza uqhagamshelo oluhambelanayo nolungenasiphako. Iingqimba ze-nickel ezifanayo phantsi kwegolide zithintela i-oxidation kunye nokufuduka, zomeleza ukumelana nokugqwala kwaye zixhasa imijikelo emininzi yokunyibilikisa i-soldering. Kwizifundo ezilawulwayo, i-ENIG PCB igqiba kakuhle kune-HASL ngokugcina ukumelana okuncinci koqhagamshelwano kunye nokuqina okuphuculweyo phantsi komswakama ophezulu kunye noxinzelelo lobushushu. Kwimveliso ye-elektroniki ephucukileyo, i-ENIG igqiba inyusa ukuthembeka kwetekhnoloji yokuxhoma umphezulu kwaye ikhusela ekonakaleni kokusingqongileyo.
Ukuphucula iNkqubo yakho yePCB nge-LONN-T850 XRF Plating Thickness Tester
Iimpawu eziPhambili ze-LONN-T850 XRF Analyzer
Isixhobo sokuvavanya ubukhulu beplatingi ye-LONN-T850 XRF yeLonnmeter sisebenzisa i-Silicon Drift Detector (SDD) enesisombululo esiphezulu ukuze ilinganise ngokuchanekileyo iileya ze-nickel-phosphorus kunye negolide kwimveliso yebhodi yesekethe eprintiweyo ye-PCB. Esi sisixhobo sifumana ukuchaneka kobukhulu ukuya kuthi ga kwi-nanometers, kubalulekile ukuze kuhlangatyezwane nemigangatho yobukhulu beplatingi ye-ENIG. Iindlela zokulinganisa ze-XRF ezidityaniswe kwi-LONN-T850 zibonelela ngamazinga okuphumelela afanelekileyo kwimigca yemveliso ephezulu, zixhasa uhlalutyo lwebhetshi ukuya kuthi ga kwiisampulu ezingama-300 ngeyure. Ukufunyanwa kwedatha ngokukhawuleza kwenza impendulo yenkqubo ekhawulezileyo, kususwe ukulibaziseka okuxhaphakileyo kwiindlela ezitshabalalisayo.
Ukuhlanganiswa okungenamthungo kunye neMisebenzi yokwenziwa kwePCB
Iimpawu zengxelo ezizenzekelayo ziqinisekisa ukulandeleka kwayo yonke i-PCB elinganisiweyo, ihambelana neemfuno zolawulo lomgangatho kuyilo lwebhodi yesekethe eprintiweyo kunye nokwenziwa kwayo. Ujongano olusebenziseka lula, oluyilelwe ixesha elincinci loqeqesho, lunceda ukwamkelwa ngokukhawuleza ngabasebenzi abatsha kunye neenjineli ezinamava ngokufanayo. Yonke idatha yokulinganisa ingathunyelwa ngaphandle ukuze kulawulwe inkqubo yezibalo kunye nokuphononongwa kophicotho, okwenza kube lula ukuthotyelwa kweenkcukacha-manani zenkqubo ye-nickel yokuntywiliselwa kwegolide engenambane.
Ukubonelela ngokuGqwesileyo kuLawulo lwe-ENIG Plating
Ukuthintela iziphene ezisebenzayo kufezekiswa ngokubeka uphawu lokuphambuka ngaphambi kokuba kuhlanganiswe, kuxhasa ulawulo olufanelekileyo lomgangatho we-PCB plating. Ubuchule be-analyzer ngaxeshanye be-multi-layer buthintela ukufuduka kwe-nickel kwaye buqinisekisa ukuba iindawo zokudibanisa i-solder ziqinile, zidlula iindlela zemveli zokulinganisa ubukhulu bomphezulu we-PCB. Iimeko zokusetyenziswa ziqala kwizicelo zegolide zokuntywiliselwa kwe-nickel ezingena-electro kwi-elektroniki ukuya kwi-ENIG vs. i-HASL PCB finishes, zibonelela ngeziphumo ezisemgangathweni nezithembekileyo zokwenziwa kwebhodi yesekethe eprintiweyo.
Cela iKoteshini ye-LONN-T850 XRF Analyzer
Iqela leenkonzo zobugcisa laseLonnmeter linceda ngeziphakamiso ezenziwe ngokwezifiso kunye nenkxaso yenkqubo, liphucula ukuphuculwa komgangatho kunye nokuphuculwa kwemveliso kwi-nickel gold plating yeebhodi zesekethe. Ifomu yesicelo sedijithali ivumela izisombululo ezenzelwe wena, yenza lula inkqubo yekowuteshini kwiinjineli kunye nabathengi.
Imibuzo ebuzwa rhoqo
Yintoni ukulinganiswa kobukhulu beplati kwaye kutheni kubalulekile ekuthembekeni kwePCB?
Ukulinganiswa kobukhulu beplati kulinganisa iileya ze-nickel kunye negolide kumphezulu we-PCB. Ubukhulu obungaphaya kobubanzi bubangela ukungatshibiliki kakuhle, bubeka emngciphekweni ukugqwala kwe-black pad, kwaye bukhawulezisa ukufuduka kwegolide.
Zithini ubukhulu obucetyiswayo bokugquma kwe-ENIG kwimveliso ye-PCB?
Izikhokelo zoshishino zichaza i-nickel kwi-2.5–7 μm kunye negolide kwi-0.05–0.23 μm. Ezi ntlobo ziphucula ukuthembeka kwejoyinti ye-solder, zithintela ukubola kwe-nickel, kwaye zithintele ukufuduka kwegolide ngelixa zinciphisa ukusetyenziswa kwegolide ngokungeyomfuneko.
Ixesha lokuthumela: Matshi-19-2026
